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Silicone encapsulating compound; white; -50÷180°C; 1.2g/cm3
| Manufacturer |
AG TERMOPASTY |
| Type of chemical agent |
silicone encapsulating compound |
| Colour |
white |
| Application |
sealing and encapsulation of electronic circuits |
| Shore hardness |
20 |
| Operating temperature |
-50...180°C |
| Thermal conductivity |
1.5W/mK |
| Density |
1.2g/cm<sup>3</sup> |
| Dielectric strength |
14.4kV/mm |
| Mix ratio |
1:1 |
| Bonding time |
70min |
| Appearance |
liquid |
| Surface resistance |
<22TΩ |
| Agent features |
condensation cure two-component |
| Net weight |
0.1kg |