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Silicone encapsulating compound; transparent; 50÷180°C; 11kV/mm
| Manufacturer |
AG TERMOPASTY |
| Type of chemical agent |
silicone encapsulating compound |
| Colour |
transparent |
| Application |
sealing and encapsulation of electronic circuits |
| Shore hardness |
12 |
| Operating temperature |
50...180°C |
| Density |
980mg/cm3 |
| Dielectric strength |
11kV/mm |
| Mix ratio |
3:2 |
| Bonding time |
60min |
| Appearance |
liquid |
| Surface resistance |
<480TΩ |
| Agent features |
condensation cure two-component |
| Net weight |
0.1kg |