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Silicone encapsulating compound; white; Temp: -50÷200°C; 20kV/mm
| Manufacturer |
AG TERMOPASTY |
| Type of chemical agent |
silicone encapsulating compound |
| Colour |
white |
| Application |
sealing and encapsulation of electronic circuits |
| Shore hardness |
59 |
| Operating temperature |
-50...200°C |
| Thermal conductivity |
1.2W/mK |
| Density |
1.2g/cm<sup>3</sup> @ 25°C |
| Dielectric strength |
20kV/mm |
| Mix ratio |
100:10 |
| Bonding time |
30min |
| Dielectric constant |
3 |
| Appearance |
paste |
| Available labels languages |
BG CZ EN ES FI FR HU IT PL RO SK |
| Surface resistance |
<2410TΩ |
| Agent features |
condensation cure two-component |
| Signal word |
Danger |
| Hazard statements |
H226: Flammable liquid and vapour. H319: Causes serious eye irritation H332: Harmful if inhaled H335: May cause respiratory irritation. H360D: May damage the unborn child. H372: Causes damage to organs |
| Precautionary statements |
P202: Do not handle until all safety precautions have been read and understood. P210: Keep away from heat/sparks/open flames/hot surfaces. – No smoking. P260: Do not breathe dust/fume/gas/mist/vapours/spray. P280: Wear protective gloves/protective clothing/eye protection/face protection. P303 + P361 + P353: IF ON SKIN (or hair): Remove/Take off immediately all contaminated clothing. Rinse skin with water/shower. P304 + P340: IF INHALED: Remove victim to fresh air and keep at rest in a position comfortable for breathing. P308 + P313: IF exposed or concerned: Get medical advice/attention. |
| Curing method |
RTV |
| Net weight |
1kg |
| GHS Code |
GHS02 GHS07 GHS08 |