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Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
| Manufacturer |
MEIG SMART TECHNOLOGY |
| Type of communications module |
IoT |
| Case |
M.2 |
| Transmission |
5G LTE LTE-FDD LTE-TDD Sub-6G |
| Dimensions |
30x52x2.3mm |
| Communictions protocol |
ECM NDIS RNDIS TCP UDP |
| Interface |
E-SIM GPIO PCIe PCM SIM UART USB |
| Operating temperature |
-40...85°C |
| Components |
Qualcomm X62 |