SI485 - Heatsinks - equipment

SI485
Description

Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV

Specifications
Manufacturer ALUTRONIC
Type of heatsink accessories heat transfer pad
Kind of heat transfer pad silicone
Application SOT32
Material glass fiber reinforced silicone
Dimensions 7.9x11.1mm
Thickness 0.18mm
Thermal conductivity 0.9W/mK
Operating temperature -60...200°C
Dielectric strength 4kV
Mounting screw
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Development and design: Seventh Cat