SI485 - Heatsinks - equipment

SI485
Description

Heat transfer pad: silicone; SOT32; Thk: 0.18mm; 900mW/mK; 4kV

Specifications
Manufacturer ALUTRONIC
Type of heat transfer pad silicone
Application SOT32
Material glass fiber reinforced silicone
Thickness 0.18mm
Thermal conductivity 0.9W/mK
Operating temperature -60...200°C
Dielectric strength 4kV
Dimensions 7.9x11.1mm
Mounting screw
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Development and design: Seventh Cat