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Home / Catalog / TME catalog / Workplace Equipment / Chemical products / Encapsulating materials / MBG0001G24

MBG0001G24 - Encapsulating materials

MBG0001G24
Description

Silicone encapsulating compound; -60÷200°C; 23kV/mm; 1kg

Specifications
Manufacturer MOREK
Type of chemical agent silicone encapsulating compound
Application filling
isolation
Kind of package bucket
Operating temperature -60...200°C
Dielectric strength 23kV/mm
Agent features high dielectric strength
Net weight 1kg
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