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Home / Catalog / TME catalog / Semiconductors / Semiconductors - accessories / Heatsinks - equipment / GS/66/P

GS/66/P - Heatsinks - equipment

GS/66/P
Description

Heat transfer pad: mica; TO66; 0.4K/W; L: 18mm; W: 13.5mm

Specifications
Manufacturer FISCHER ELEKTRONIK
Type of heat transfer pad mica
Application TO66
Thermal resistance 0.4K/W
Length 18mm
Width 13.5mm
Thickness 50µm
Mounting hole diameter 3.7mm
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