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Home / Catalog / TME catalog / Semiconductors / Semiconductors - accessories / Heatsinks - equipment / GS/3/P/SL

GS/3/P/SL - Heatsinks - equipment

GS/3/P/SL
Description

Heat transfer pad: mica; TOP3; 0.4K/W; L: 20.5mm; W: 17.5mm

Specifications
Manufacturer FISCHER ELEKTRONIK
Type of heat transfer pad mica
Application TOP3
Thermal resistance 0.4K/W
Length 20.5mm
Width 17.5mm
Thickness 50µm
Mounting hole diameter 3.1mm
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