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Home / Catalog / TME catalog / Semiconductors / Semiconductors - accessories / Heatsinks - equipment / GS/3

GS/3 - Heatsinks - equipment

GS/3
Description

Heat transfer pad: mica; TO3; 0.4K/W; L: 43mm; W: 30mm; Thk: 0.05mm

Specifications
Manufacturer FISCHER ELEKTRONIK
Type of heat transfer pad mica
Application TO3
Thermal resistance 0.4K/W
Length 43mm
Width 30mm
Thickness 50µm
Mounting hole diameter 4.2mm
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