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Home / Catalog / TME catalog / Semiconductors / Semiconductors - accessories / Heatsinks - equipment / GL535/N

GL535/N - Heatsinks - equipment

GL535/N
Description

Heat transfer pad: mica; TO218,TOP3; Thk: 0.05mm; 800mW/mK; 2.5kV

Specifications
Manufacturer ALUTRONIC
Type of heat transfer pad mica
Application TO218
TOP3
Thickness 50µm
Thermal conductivity 0.8W/mK
Dielectric strength 2.5kV
Dimensions 22x18mm
Mounting screw
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