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Solder paste; lead free; Sn96,5Ag3Cu0,5; can; 25÷45um; 250g; 217°C
| Manufacturer |
AG TERMOPASTY |
| Type of solder |
solder paste |
| Appearance |
paste |
| Kind of solder |
lead free |
| Alloy composition |
Sn96,5Ag3Cu0,5 |
| Kind of package |
can |
| Grain size |
25...45µm |
| Binder weight |
0.25kg |
| Melting point |
217°C |
| Flux content |
12% |
| Kind of flux |
halide-free No Clean REL0 |
| Caution! |
Store in temperature about 8 °C |
| Agent features |
lead free residues can be cleaned with alcohol-based agents residues need no cleaning |
| Signal word |
Warning |
| Hazard statements |
H317: May cause an allergic skin reaction. H360FD: May damage fertility. May damage the unborn child. |
| Precautionary statements |
P201: Obtain special instructions before use. P261: Avoid breathing dust/fume/gas/mist/vapours/spray. P280: Wear protective gloves/protective clothing/eye protection/face protection. P308 + P313: IF exposed or concerned: Get medical advice/attention. P333 + P313: If skin irritation or rash occurs: Get medical advice/attention. P362 + P364: Take off contaminated clothing and wash it before reuse. P501: Dispose of contents/container to ... |
| Version |
for soft soldering |
| GHS Code |
GHS07 GHS08 |
| Flux residues |
non-corrosive transparent yes |