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Silicone encapsulating compound; transparent; Temp: -50÷180°C
| Manufacturer |
AG TERMOPASTY |
| Type of chemical agent |
silicone encapsulating compound |
| Colour |
transparent |
| Application |
sealing and encapsulation of electronic circuits |
| Operating temperature |
-50...180°C |
| Density |
980mg/cm<sup>3</sup> @ 25°C |
| Mix ratio |
3:2 |
| Bonding time |
70min |
| Resistance to |
UV rays |
| Available labels languages |
BG CZ DE EN FI FR HU PL RO RU SK |
| Agent features |
additive linking two-component |
| Net weight |
0.1kg |