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Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
| Manufacturer |
BOYD CORP |
| Type of heatsink |
extruded |
| Heatsink shape |
grilled |
| Application |
BGA FPGA |
| Colour |
black |
| Length |
23mm |
| Width |
23mm |
| Height |
18mm |
| Thermal resistance |
23.4K/W |
| Material |
aluminium |
| Material finishing |
anodized |